| 配方類型： |
METALS |
| 配方說明： |
Flux-Free Soldering of Aluminum to Stainless Steel |
| 配方組成： |
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| 配制方法： |
A flux-free method of soldering aluminum to stainless steel at low temperatures, providing a gas-tight, durable bond has been developed as part of a research project sponsored by the Atomic Energy Commission.
With other soldering techniques, occlusion of flux invariably destroyed the joint through electrolytic action.
The stainless steel is cleaned with an abrasive, washed in trichloroethylene, coated with a solution of equal parts of water and concentrated hydrochloric acid, preheated to 450F, tinned with a solder of 50% lead, 50% tin, and rinsed with hot water to remove any acid that may not have been removed by preheating.
The aluminum is cleaned with abrasive and washed in trichloroethylene.
After preheating to about 650F, it is tinned with aluminum solder, consisting of approximately 1% silver, 0.01% aluminum, 0.01% copper, 1% iron, 1% lead, 0.1% silicon, and the rest tin (aluminum solder of this composition is available from various commercial sources).
The two surfaces are pl |
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