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化學(xué)配方數(shù)據(jù)庫(kù)
配方類型： METALS AND TREATMENTS
配方說(shuō)明： Copper Plating
配方組成： Average Current Density, no agitation/75-125 amp/sq ft
Copper Metal (Cu)/60 g/l
Limiting* Current Density at 80F/150 amp/sq ft
Limiting* Current Density at 120F/250 amp/sq ft
Operating Conditions pH (colorimetric)/0.8 to 1.7
Average Tank Voltage/3-5
*Maximum Current Density without burning based on laboratory in
thickness using no agitation.
Boric Acid/15 g/l
Temperature/80-170F
Copper Fluoborate (Cu(BF4)2)/224 g/l
Cathode Current Density:
Baume at

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