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配方類型： METALS AND TREATMENTS
配方說明： Electroless Lead Plating
配方組成： Thiourea/35 g
Dimethyl sulfoxide/175 ml
Lead nitrate/35 g
配制方法： At a temperature of 45C a smooth, bright lead deposit was obtained on copper. The authors did not try the method on other basis metals; however, if it is unsuitable on steel, a light copper plate could be applied first.

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